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OEM Electronic Pcb Board Assembly HDI Pcba Manufacturer
PCB geometry also plays a fundamental role, where geometry means laminate thickness and transmission line characteristics. With regard to the first point, it is necessary to choose a laminate thickness which is typically between 1/4 and 1/8 of highest operating frequency’s wavelength. If the laminate is too thin, there is a risk of it resonating, or even propagating the waves through the conductors. With regard to transmission lines, it is necessary to decide which type of conductor you want to use: microstrip, stripline, or grounded coplanar waveguide (GCPW). Microstrips are probably the most familiar ones, but they have problems with radiated losses and spurious mode propagation above 30 GHz. Striplines are a valid solution, too, but they are difficult to manufacture and therefore more expensive. In addition, microvias must be used to connect the striplines to the outermost layers. GCPWs are an excellent choice but they offer higher conduction losses than microstrips and striplines.
1. Product application
Any layer of interconnect board products can be applied to mobile communication terminals, which integrates a variety of circuits, enabling mobile terminals to handle complex tasks and have rich communication methods. With the development of communication technologies, mobile terminals have become modern Internet services. The main platform.
2 . Specifications:
| Name | 10Layer anylayer HDI PCB for 5G mobile phone motherboard |
| Layer | 10 |
| Quality Grade | IPC 6012 Class 2,IPC 6012 Class 3 |
| Material | EM370 |
| Min Track/Spacing | 75um/100um |
| Drilling Size | 100um |
| Solder Mask | Green |
| Silkscreen | White |
| Surface Finish | Immersion gold |
| Finished Copper | 1/3OZ |
| Production time | 10-21 working days |
| Lead time | 2-3 days |
PCBs for high frequency applications require to be subjected to automatic inspection procedures, both optical (AOI) or performed through ATE. These procedures allow to enormously increase the quality of the product, highlighting possible errors or inefficiencies of the circuit. The recent progress made in the field of automatic inspection and testing of PCBs has led to significant time savings and reduced costs associated with manual verification and testing. The use of new automated inspection techniques will help overcome the challenges imposed by 5G, including global impedance control in high frequency systems. Increased adoption of automated inspection methods also allows for consistent performance with high production rates.