Topmatch Electronics (Suzhou) Co., Limited.

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2 layer rigid flex pcb board with connector Sidekey for mobile phones WP27D-P010VA1

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Topmatch Electronics (Suzhou) Co., Limited.
City:suzhou
Province/State:jiangsu
Country/Region:china
Contact Person:MrJerry He
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2 layer rigid flex pcb board with connector Sidekey for mobile phones WP27D-P010VA1

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Brand Name :TOPCBS
Model Number :2Layer flex sidekey board with connector WP27D-P010VA1 apply for mobile phones
Certification :UL94V0
Place of Origin :Suzhou China
MOQ :Negotiation
Price :Negotiation
Payment Terms :T/T
Supply Ability :10000unit per month
Delivery Time :10-14working days
Packaging Details :20units per package box size 20*15*10cm
Board type :FPCA
Struction :2Layer
Connector :WP27D-P010VA1
Finished treatment :Chemical gold
Material :FCCL
Stiffener :Steel disc
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2Layer flex sidekey board with connectors WP27D-P010VA1 apply for Mobile phones

There are many benefits to use a flexible printed circuit board in your application:

  • Lightweight; Flex circuit's polyimide material is lighter than FR4.
  • Thin; A typical 2-layer flex can range in thickness between 4.4 and 10 mils.
  • Flexible; This is obvious, but with the ability to make bends, you have more freedom to decrease the overall mechanical footprint.
  • High Temperature; Polyimide flex materials are suited for very high temperatures compared to FR4. They are also resistant to oils, gases, and acids.

Name 2Layer flex sidekey board with connector WP27D-P010VA1 apply for Mobile phones
Number of Layers 32L
Quality Grade IPC 6012 Class 2,IPC 6012 Class 3
Material FCCL
Board Thickness 200um
Min Track/Spacing 5/5mil
EMI NA
Coverlayer color Yellow
Silkscreen White
Surface Finish Gold plated
Finished Copper HOZ
Stiffener Steel disc

What is Rigid-Flex printed circuit boards?

Rigid-Flex printed circuit boards are boards using a combination of flexible and rigid board technologies in an application. Most rigid flex boards consist of multiple layers of flexible circuit substrates attached to one or more rigid boards externally and/or internally, depending upon the design of the application. The flexible substrates are designed to be in a constant state of flex and are usually formed into the flexed curve during manufacturing or installation Rigid-Flex designs are more challenging than the design of a typical rigid board environment, as these boards are designed in a 3D space, which also offers greater spatial efficiency. By being able to design in three dimensions rigid flex designers can twist, fold and roll the flexible board substrates to achieve their desired shape for the final application's package.

Rigid-Flex PCBs Fabrication Applications

Rigid-Flex PCBs offer a wide array of applications, ranging from military weaponry and aerospace systems to cell phones and digital cameras. Increasingly, rigid flex board fabrication has been used in medical devices such as pacemakers for their space and weight reduction capabilities. The same advantages for rigid flex PCB usage can be applied to military weaponry and weapon control systems.

In consumer products, Rigid-Flex doesn't just maximize space and weight but greatly improves reliability, eliminating many needs for solder joints and delicate, fragile wiring that are prone to connection issues. These are just some examples, but Rigid-Flex PCBs can be used to benefit nearly all advanced electrical applications including testing equipment, tools and automobiles.

Rigid-Flex PCBs Technology and Production Process

Whether producing a rigid flex prototype or production quantities requiring large scale Rigid-Flex PCBs fabrication and PCB assembly, the technology is well proven and reliable. The flex PCB portion is particularly good in overcoming space and weight issues with spatial degrees of freedom.

Careful consideration of Rigid-Flex solutions and a proper assessment of the available options at the early stages in the rigid flex PCB design phase will return significant benefits. It is critical the Rigid-Flex PCBs fabricator is involved early in the design process to ensure the design and fab portions are both in coordination and to account for final product variations.

The Rigid-Flex manufacturing phase is also more complex and time consuming than rigid board fabrication. All the flexible components of the Rigid-Flex assembly have completely different handling, etching and soldering processes than rigid FR4 boards.

Rigid-Flex Design and Fabrication Issues

During the Rigid-Flex PCBs design process, certain considerations must be taken into account for final product size variations. In the manufacture of Rigid-Flex boards, the flexible polyimide core will shrink once the bonded copper foil is etched away. This variation must be accounted for in the design process.

The final Rigid-Flex assembly process requires the flex portions to be bent into shape, stressing the flex laminations with the potential to cause stress fractures.

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