Topmatch Electronics (Suzhou) Co., Limited.

Do best to meet your technical in PCBs

Manufacturer from China
Active Member
4 Years
Home / Products / Tcon PCB /

Tcon Lcm Pcb Soft Gold Finger Pcb Board 12 Layer HDI PCBA

Contact Now
Topmatch Electronics (Suzhou) Co., Limited.
City:suzhou
Province/State:jiangsu
Country/Region:china
Contact Person:MrJerry He
Contact Now

Tcon Lcm Pcb Soft Gold Finger Pcb Board 12 Layer HDI PCBA

Ask Latest Price
Video Channel
Brand Name :TOPCBS
Model Number :TCON Rigid flex board
Certification :UL94V0
Place of Origin :Suzhou China
MOQ :Negotiation
Price :Negotiation
Payment Terms :T/T
Supply Ability :10000unit per month
Delivery Time :10-14working days
Packaging Details :20units per package box size 20*15*10cm
Layer count :12Layer 5+2L (flex) + 5
Board thickness :1.1mm
Raw material :Polymide,High Tg FR4
Finished Treatment :Immersion Gold
Copper Thickness :12um to 35um
Impendence :100ohm+/-10%
Key process :Buried, Blind, Cu fill, laser drilling
Components :Yes
more
Contact Now

Add to Cart

Find Similar Videos
View Product Description

12Layer Rigid-flex HDI PCBA for Tcon LCM / Soft gold finger

Specifications:
1. Certificate of UL, ISO9001, ISO14001.
2. 4-5 days fast PCB and FPC delivery
3. Our Products meet the RoHS & WEEE lead-free requirement.
4. Minimum Order: 1 Pieces
5. PCB and FPC manufacturer

1.Generation of T-con

The gold finger material Polymide is thin and flexible. Other areas material CCL FR4.

2 . Specifications:

Name 12Layer Rigid-flex HDI pcb for Tcon LCM / Soft gold finger
Layers 12
Quality Grade IPC 6012 Class 2,IPC 6012 Class 3
Material Polymide + FR4
Min Track/Spacing 75um/100um
Drilling Size 100um
Solder Mask Green
Silkscreen White
Surface Finish Immersion gold
Finished Copper 1/3OZ
Production time 10-21 working days
Lead time 2-3 days

  1. Product Category: Flexible or Rigid-flex board
  2. Monthly Output: 12000 square meters
  3. Circuit Layers: Single-sided/Double-sided/Multi-layer
  4. Material: PolymidePolysterPETPTRolling Electrolysis
  5. Solder Mask: Laminated cover filmLiquid photosensitive prevent weld inkPI oil film
  6. Surface treatment: Hot Air Solder LevelingTinningSink tinGold-PlatingChemistry sink goldAuti-oxidation Sink copper Tin copper
  7. Electronics Immersion Gold: Au: 0.025-0.075um Ni: 1.0-5.0um
  8. Min. Hole Size: 0.2mm
  9. Min. W/S via Pad Size: 0.05&0.05mm
  10. Outline: 350*720mm
  11. Confidence Test: Buckling>100,000 times
Inquiry Cart 0